Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components
ثبت نشده
چکیده
The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that consistently withstand peak reflow temperatures of 240°C to 260°C. Reflow soldering at these extreme temperatures, especially after extended moisture exposure, introduces several challenges that must be solved to produce reliable products. This white paper covers some of the modifications necessary and Altera® packaging solutions available to meet reliability and usability requirements for lead-free and RoHS-compliant products.
منابع مشابه
Conventional Tin-Lead and RoHS-Compliant Lead-Free Components
1 While lead-frame and wire-bond packages can be provided as eutectic or lead-free, currently Altera flip-chip packages are RoHS compliant. We use Exemption #15 for the first Level Connections between the flip-chip die to the substrate (RoHS Exemption #15: Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within the integrated circuit flip-...
متن کاملElimination of Cadmium and Lead from Autocatalytic Nickel Chemistry for Electronics Applications
The elimination of compounds such as lead (Pb) and cadmium (Cd) from electrical and electronic equipment as a result of the Restriction of Hazardous Substances (RoHS) annex of the European Union’s Waste from Electrical and Electronic Equipment (WEEE) Directive 2002/95/EC is rapidly approaching the deadline of July 1, 2006. While the RoHS annex to the WEEE directive specifically refers to restri...
متن کاملImpact of Lead-free Components and Technology Scaling for High Reliability Applications
Semiconductor technology is increasingly meeting the demands and challenges posed by roadmaps such as ITRS in terms of technology scaling and packaging, where the interconnect size is decreasing to ever smaller dimensions. The drive for this is increasing functionality of the devices and is governed primarily by the consumer electronics markets. For applications in high reliability sectors such...
متن کاملRoHS Implementation Challenges
Implementation of the RoHS presents special challenges for small and medium sized companies. Limited staff and dependence on outsourced services creates cost burdens for smaller OEMs. The first major challenge is conversion of existing product Bills of Materials. Conversion is usually much more involved than just re-specifying RoHS compliant parts on the AVL. For some components, it may be diff...
متن کاملRobust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology, measurement methods and experimental results for the optimization of a lead free SMT process for use in an Automotive Electronics application. The key strategy is to find process parameters that make the process insensitive to noise factors. Traditional optimization approaches focus on maximizing the response variable while ...
متن کامل